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公开(公告)号:US12127379B2
公开(公告)日:2024-10-22
申请号:US18135053
申请日:2023-04-14
Applicant: Microsoft Technology Licensing, LLC
Inventor: Peter Alfred Devick Peterson , Nilofer Rajpurkar , John Reed Hannig , Patrick Gerard Brogan , Scott Allen Densmore , Kenneth S. Hayd
CPC classification number: H05K7/20736 , G06F1/206 , H05K7/20 , Y02D10/00
Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.
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公开(公告)号:US20240349460A1
公开(公告)日:2024-10-17
申请号:US18648708
申请日:2024-04-29
Applicant: SolarEdge Technologies Korea Limited Company
Inventor: Ho-June Yu , Jeong-Hyun Bang , Jong-sik Park
IPC: H05K7/20
CPC classification number: H05K7/20736 , H05K7/20145
Abstract: Disclosed is a containerized heating, ventilation, and air-conditioning (HVAC) system comprising an HVAC unit and one or more ducts from the HVAC unit to an equipment rack. The ducts prevent mixing between the fresh and exhaust airflow, thus improving efficiency. Sensors located at sources of heat generating equipment within the racks may be used by controllers to monitor temperatures of the components at the source of heat generation, typically at the highest temperatures. The temperatures may be aggregated to determine the temperatures of devices, modules, racks, and the container interior cavity. Dampers on the ducts, at the rack inlets, at the module inlets, at the devices inlets, and such may assist in regulating airflow preferentially to the hottest components, devices, modules, or racks.
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公开(公告)号:US12120854B2
公开(公告)日:2024-10-15
申请号:US17547701
申请日:2021-12-10
Applicant: Ciena Corporation
Inventor: Daniel Rivaud , Peter Ajersch , Michael Bishop , Anthony Mayenburg
IPC: H05K7/20
CPC classification number: H05K7/20736 , H05K7/202 , H05K7/20263
Abstract: A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.
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公开(公告)号:US12081323B2
公开(公告)日:2024-09-03
申请号:US18116957
申请日:2023-03-03
Applicant: Intel Corporation
Inventor: Murugasamy K. Nachimuthu , Mohan J. Kumar , Vasudevan Srinivasan
IPC: G06F8/65 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F3/06 , G06F9/30 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G06F15/16 , G06F16/901 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04B10/25 , H04L41/14 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L49/00 , H04L49/25 , H04L49/356 , H04L49/45 , H04L67/02 , H04L67/12 , H04L67/306 , H04L69/04 , H04L69/329 , H04Q11/00 , H05K7/14 , B25J15/00 , B65G1/04 , G05D23/19 , G05D23/20 , G06F9/38 , G06F9/50 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F13/42 , G06F15/80 , G06Q10/06 , G06Q10/0631 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/00 , G11C5/06 , H04J14/00 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/28 , H04L41/02 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/70 , H04L47/765 , H04L47/78 , H04L47/80 , H04L49/15 , H04L49/55 , H04L61/00 , H04L67/00 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/51 , H04Q1/04 , H04W4/02 , H04W4/80 , H05K1/02 , H05K1/18 , H05K5/02 , H05K7/20 , H05K13/04
CPC classification number: H04L43/08 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G06F1/183 , G06F1/20 , G06F3/0613 , G06F3/0625 , G06F3/064 , G06F3/0653 , G06F3/0655 , G06F3/0664 , G06F3/0665 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/30036 , G06F9/4401 , G06F9/544 , G06F12/109 , G06F12/1408 , G06F13/1668 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F15/161 , G06F16/9014 , G08C17/02 , G11C5/02 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/3086 , H03M7/4056 , H03M7/4081 , H04B10/25891 , H04L41/145 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L49/00 , H04L49/25 , H04L49/357 , H04L49/45 , H04L67/02 , H04L67/306 , H04L69/04 , H04L69/329 , H04Q11/0003 , H05K7/1442 , B25J15/0014 , B65G1/0492 , G05D23/1921 , G05D23/2039 , G06F3/061 , G06F3/0611 , G06F3/0616 , G06F3/0619 , G06F3/0631 , G06F3/0638 , G06F3/0647 , G06F3/0658 , G06F3/0659 , G06F3/067 , G06F9/3887 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F13/161 , G06F13/1694 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C2200/00 , G11C5/06 , H03M7/30 , H03M7/3084 , H03M7/40 , H03M7/4031 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04J14/00 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/15 , H04L49/555 , H04L61/00 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/34 , H04L67/51 , H04Q1/04 , H04Q11/00 , H04Q11/0005 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/00 , Y02P90/30 , Y04S10/50 , Y04S10/52 , Y10S901/01
Abstract: Embodiments are generally directed apparatuses, methods, techniques and so forth determine an access level of operation based on an indication received via one or more network links from a pod management controller, and enable or disable a firmware update capability for a firmware device based on the access level of operation, the firmware update capability to change firmware for the firmware device. Embodiments may also include determining one or more configuration settings of a plurality of configuration settings to enable for configuration based on the access level of operation, and enable configuration of the one or more configuration settings.
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公开(公告)号:US12075582B2
公开(公告)日:2024-08-27
申请号:US17285232
申请日:2019-10-15
Applicant: NEC Platforms, Ltd.
Inventor: Yuji Horii
CPC classification number: H05K5/03 , H05K7/20145 , H05K7/20736 , H05K7/20136
Abstract: An electronic apparatus including a housing; a plurality of accommodating portions, formed in the housing, each having an opening portion that opens towards an outside of the housing; an electronic component unit having a unit body accommodated in at least one first accommodating portion among the plurality of accommodating portions, and a unit cover that is installed on the opening portion of the first accommodating portion and that has a first connection opening connecting an inside and an outside of the first accommodating portion; and a dummy cover that is installed on the opening portion of a second accommodating portion different from the first accommodating portion among the plurality of accommodating portions, and that has a second connection opening connecting an inside and an outside of the second accommodating portion.
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公开(公告)号:US12063762B2
公开(公告)日:2024-08-13
申请号:US17652323
申请日:2022-02-24
Applicant: Dynamic Data Centers Solutions, Inc.
Inventor: Mark David Ortenzi , Chris Orlando
IPC: H05K7/20
CPC classification number: H05K7/20818 , H05K7/20327 , H05K7/20336 , H05K7/20736
Abstract: A cooling system for cooling chips in a server rack uses a heat pipe, providing a cooled connection to the chips in a server rack. A coolant for the heat pipe is located outside the rack, so that water never needs to be brought into the rack.
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公开(公告)号:US20240265903A1
公开(公告)日:2024-08-08
申请号:US18165838
申请日:2023-02-07
Applicant: Quanta Computer Inc.
Inventor: Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: G10K11/168 , H05K7/20
CPC classification number: G10K11/168 , H05K7/20736
Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.
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公开(公告)号:US20240237306A9
公开(公告)日:2024-07-11
申请号:US18047825
申请日:2022-10-19
Applicant: Dell Products L.P.
Inventor: CURTIS RAY GENZ , YU-HUNG WANG , NICOLE MUTESI , RANDY ALTON FRAZIER , DONALD W. GERHART
IPC: H05K7/20
CPC classification number: H05K7/20836 , H05K7/20136 , H05K7/20736
Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may heat them when their temperatures fall outside of thermal operating ranges. To mitigate some risk associated with heating, the data processing system may proactively calibrate temperature sensors used to guide the heating process.
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公开(公告)号:US11978875B2
公开(公告)日:2024-05-07
申请号:US15397256
申请日:2017-01-03
Applicant: NEC Energy Solutions, Inc.
Inventor: Erik C. Nelson , Scott Reitsma , James S. Tela , Bryan Nelson
IPC: H01M10/6563 , H01M6/50 , H01M10/42 , H01M10/613 , H05K7/20
CPC classification number: H01M10/6563 , H01M6/5038 , H01M10/613 , H05K7/20736 , H05K7/20745 , H01M2010/4271
Abstract: A method of cooling a rack of heat dissipating components comprises cooling air, and porting the cooled air into a volume in front of the rack from above the volume. The method further comprises moving the cooled air from the volume in front of the rack to a plenum at a rear portion of the rack to pressurize the plenum. The cooled air is moved with an air mover disposed at a bottom portion of the rack, The method also comprises flowing air from the pressurized plenum past or through heat dissipating components in the rack to the volume in front of the rack, by force of pressure in the plenum through air-directing ports in the plenum. The air may be flowed through the heat dissipating components, around the heat dissipating components, or both. The method further comprises drawing warm air from an upper portion of the volume in front of the racks to cool it again.
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公开(公告)号:US11934242B2
公开(公告)日:2024-03-19
申请号:US17103413
申请日:2020-11-24
Applicant: Nvidia Corporation
Inventor: Alex R. Naderi
CPC classification number: G06F1/26 , G06F1/206 , G06F1/30 , H05K7/20236 , H05K7/20736 , H05K7/20781 , H05K7/20818 , H05K7/20836
Abstract: Provided, in one aspect, is a data center. The data center, in this aspect, includes a data center enclosure, the data center enclosure designed for a given supply of power (Ps). The data center, according to this aspect, further includes N independent coolable clusters of data center racks located within the data center enclosure, wherein N is at least two, and further wherein the N independent coolable clusters each have an ostensible power demand (Pos) approximately equal to Ps/N, and each of the N independent coolable clusters has a respective actual power demand (Pac) adjustable at, above or below the ostensible power demand (Pos).
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