Containerized HVAC Control
    2.
    发明公开

    公开(公告)号:US20240349460A1

    公开(公告)日:2024-10-17

    申请号:US18648708

    申请日:2024-04-29

    CPC classification number: H05K7/20736 H05K7/20145

    Abstract: Disclosed is a containerized heating, ventilation, and air-conditioning (HVAC) system comprising an HVAC unit and one or more ducts from the HVAC unit to an equipment rack. The ducts prevent mixing between the fresh and exhaust airflow, thus improving efficiency. Sensors located at sources of heat generating equipment within the racks may be used by controllers to monitor temperatures of the components at the source of heat generation, typically at the highest temperatures. The temperatures may be aggregated to determine the temperatures of devices, modules, racks, and the container interior cavity. Dampers on the ducts, at the rack inlets, at the module inlets, at the devices inlets, and such may assist in regulating airflow preferentially to the hottest components, devices, modules, or racks.

    Hybrid liquid and air cooling in networking equipment

    公开(公告)号:US12120854B2

    公开(公告)日:2024-10-15

    申请号:US17547701

    申请日:2021-12-10

    CPC classification number: H05K7/20736 H05K7/202 H05K7/20263

    Abstract: A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.

    Electronic apparatus and dummy cover

    公开(公告)号:US12075582B2

    公开(公告)日:2024-08-27

    申请号:US17285232

    申请日:2019-10-15

    Inventor: Yuji Horii

    CPC classification number: H05K5/03 H05K7/20145 H05K7/20736 H05K7/20136

    Abstract: An electronic apparatus including a housing; a plurality of accommodating portions, formed in the housing, each having an opening portion that opens towards an outside of the housing; an electronic component unit having a unit body accommodated in at least one first accommodating portion among the plurality of accommodating portions, and a unit cover that is installed on the opening portion of the first accommodating portion and that has a first connection opening connecting an inside and an outside of the first accommodating portion; and a dummy cover that is installed on the opening portion of a second accommodating portion different from the first accommodating portion among the plurality of accommodating portions, and that has a second connection opening connecting an inside and an outside of the second accommodating portion.

    INDOOR CABINETS HAVING REDUCED ACOUSTIC FOOTPRINTS

    公开(公告)号:US20240265903A1

    公开(公告)日:2024-08-08

    申请号:US18165838

    申请日:2023-02-07

    CPC classification number: G10K11/168 H05K7/20736

    Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.

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