公开(公告)号：US20220256740A1

公开(公告)日：2022-08-11

申请号：US17732684

申请日：2022-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongfu SUN ,  Jian SHI ,  Zhi YUAN ,  Linfang JIN ,  Jie YANG

IPC: H05K7/20

Abstract: This application relates to a temperature equalization component and an electronic device. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side that is of the housing and that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.

公开(公告)号：US20230022994A1

公开(公告)日：2023-01-26

申请号：US17951274

申请日：2022-09-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongfu SUN ,  Jie YANG ,  Jian SHI

IPC: G06F1/20 ,  H05K7/20 ,  H01Q1/02

Abstract: A mobile terminal includes middle frame assembly that is configured to bear an electronic component in the mobile terminal. The electronic component includes a heat source, and the middle frame assembly includes a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame includes a heat dissipation region corresponding to the heat source. The first vapor chamber is accommodated in the heat dissipation region. The heat pipes are connected to the first vapor chamber, and are configured to dissipate heat from the first vapor chamber. This structure of the mobile terminal and the middle frame assembly of the mobile terminal improves heat dissipation performance of the mobile terminal.