公开(公告)号：US20180059324A1

公开(公告)日：2018-03-01

申请号：US15795626

申请日：2017-10-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xin TU ,  Yuming WEI ,  Hongyan FU

IPC: G02B6/27 ,  G02B6/14

CPC classification number: G02B6/2766 ,  G02B6/14 ,  G02B6/34

Abstract: A polarization rotator and an optical signal processing method are disclosed. A first transceiving waveguide includes a first end and a second end; a polarization rotation region waveguide includes a first waveguide and a second waveguide, where the first waveguide is located above the second waveguide, the first waveguide is connected to the second end of the first transceiving waveguide, the first waveguide and the second waveguide are non-linear profile waveguides; a mode conversion region waveguide includes a third waveguide and a fourth waveguide, where the third waveguide is connected to the second waveguide, the fourth waveguide is on a same horizontal plane as the third waveguide and the second waveguide, the third waveguide and the fourth waveguide are non-linear profile waveguides; and the second transceiving waveguide includes a third end and a fourth end, where the third end of the second transceiving waveguide is connected to the fourth waveguide.

公开(公告)号：US20200048076A1

公开(公告)日：2020-02-13

申请号：US16657432

申请日：2019-10-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuming WEI

IPC: B81B7/02 ,  B81C1/00 ,  B81B7/00

Abstract: Embodiments of the application provide a MEMS chip and an electrical packaging method for a MEMS chip. The MEMS chip includes a MEMS device layer, a first isolating layer located under the MEMS device layer, and a first conducting layer located under the first isolating layer. At the first isolating layer, there are a corresponding quantity of first conductive through holes in locations corresponding to conductive structures in a first region and in locations corresponding to electrodes in a second region. At the first conducting layer, there are M electrodes spaced apart from one another, and the M electrodes are respectively connected to M of the first conductive through holes. At the first conducting layer, electrodes in locations corresponding to at least some of the conductive structures in the first region are electrically connected in a one-to-one correspondence to electrodes in locations corresponding to at least some of the electrodes in the second region.

公开(公告)号：US20180375289A1

公开(公告)日：2018-12-27

申请号：US16119361

申请日：2018-08-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuming WEI

IPC: H01S5/22 ,  G02B6/30 ,  H01S5/30 ,  H01S5/04

Abstract: An optical coupling connector, an optical coupling system, and a waveguide coupling method are provided. The optical coupling connector is configured to connect an optical fiber array and an optoelectronics chip, and includes an upper-layer connector and a lower-layer connector. The upper-layer connector includes N upper-layer waveguides, where N is a positive integer greater than or equal to 2. The lower-layer connector includes N lower-layer waveguides. The N lower-layer waveguides and the N upper-layer waveguides are coupled in a one-to-one correspondence. Each lower-layer waveguide includes a coupling waveguide portion, a pitch matching waveguide portion, and a signal light amplification waveguide portion.