公开(公告)号：US20220077018A1

公开(公告)日：2022-03-10

申请号：US17526966

申请日：2021-11-15

Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

Inventor： Mao Guo ,  Yiwei Ren ,  Xiaodong Zhang

IPC: H01L23/31 ,  H01L21/66 ,  H01L21/56

Abstract: A chip packaging apparatus and a preparation method thereof are provided, to modulate warpage of a chip, thereby resolving a problem of mismatch between a warpage degree of the chip and a warpage degree of a substrate. The chip packaging apparatus includes a chip, a substrate, and a warpage modulation structure, where a surface that is of the chip and that faces the substrate is electrically connected to the substrate, the warpage modulation structure is disposed on a surface that is of the chip and that is opposite to the substrate, and a coefficient of thermal expansion of the warpage modulation structure is greater than a coefficient of thermal expansion of the chip.