公开(公告)号：US11251603B2

公开(公告)日：2022-02-15

申请号：US16190769

申请日：2018-11-14

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Vincent W. Michna ,  David G. Carpenter ,  Patrick Raymond

IPC: H02H5/04 ,  H05K1/02 ,  H02H1/00

Abstract: Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.