公开(公告)号：US20210322991A1

公开(公告)日：2021-10-21

申请号：US17268971

申请日：2018-12-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Diane HAMMERSTAD ,  Alexander GOVYADINOV ,  Brian J. KEEFE ,  Erik D. TORNIAINEN ,  Tyler COCHELL ,  Pavel KORNILOVICH

IPC: B01L7/00 ,  B01L3/00 ,  B01L9/00

Abstract: A rapid thermal cycling device can include a static microfluidic reaction chamber that can be defined between a layered substrate and a cover that can have an average space therebetween from 4 μm to 150 μm. The layered substrate can include a heating element thermally coupled to the static microfluidic reaction chamber to heat a fluid when present therein. The layered substrate, the cover, or both can include a heat diffusing material thermally coupled to the static microfluidic reaction chamber to diffuse heat out from the fluid while remaining in the static microfluidic reaction chamber.