Techniques for cooling a circuit board component within an environment with little or no forced convection airflow
    1.
    发明授权
    Techniques for cooling a circuit board component within an environment with little or no forced convection airflow 有权
    在很少或没有强制对流气流的环境中冷却电路板部件的技术

    公开(公告)号:US07088586B2

    公开(公告)日:2006-08-08

    申请号:US10988713

    申请日:2004-11-15

    IPC分类号: H05K7/20

    摘要: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.

    摘要翻译: 凹陷散热器包括配置成耦合到电路板部件的中心部分,联接到中心部分的外部部分和设置在外部部分内的凹陷部分。 外部部分构造成当中心部分耦合到电路板部件时,从中心部分延伸并且将凹陷部分支撑在电路板部件的覆盖区之外。 这种散热器的凹陷部分提供比具有扁平端部的常规散热器更暴露的表面积(例如,每平方英寸),以通过自然对流进入环境空气来改善和增强散热。 此外,具有这种凹凸部分的散热器相对于更复杂的结构例如散热片或支柱是相对容易且成本有效的,从而使得制造商能够使用高容量,低成本的组装工艺来生产凹凸散热器。

    Techniques for cooling a circuit board component within an environment with little or no forced convection airflow

    公开(公告)号:US20060103013A1

    公开(公告)日:2006-05-18

    申请号:US10988713

    申请日:2004-11-15

    IPC分类号: H01L23/34

    摘要: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.

    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
    3.
    发明申请
    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board 有权
    使用从电路板的下侧安装的锚固件将散热器附接到电路板的技术

    公开(公告)号:US20060114659A1

    公开(公告)日:2006-06-01

    申请号:US11079810

    申请日:2005-03-14

    IPC分类号: H05K7/20

    摘要: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

    摘要翻译: 改进的散热器连接组件包括被配置为固定到电路板的第一位置的第一锚固件和被配置成固定到电路板的第二位置的第二锚固件。 每个锚杆包括腿部,腿部具有被配置为接触电路板的环形端部。 散热器连接组件还包括散热夹,该散热夹构造成当锚固件固定到电路板上时同时(i)固定到锚固件,以及(ii)将散热片固定在电路板的电路板部件上。 腿的环形端部防止腿部完全穿过限定在电路板中的孔。 在一些情况下,环形端部限定用于与电路板的鲁棒干涉配合以及用于增强强度和稳定性的延伸线圈(例如,双环)。

    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
    4.
    发明授权
    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board 有权
    使用从电路板的下侧安装的锚固件将散热器附接到电路板的技术

    公开(公告)号:US07324344B2

    公开(公告)日:2008-01-29

    申请号:US11001411

    申请日:2004-12-01

    IPC分类号: H05K7/20

    摘要: A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.

    摘要翻译: 散热器附接组件包括第一锚固件,第二锚固件和散热片夹具。 第一锚定构造成从电路板的下侧向电路板的上侧向上方插入电路板的第一孔。 类似地,第二锚定构件沿向上方向插入电路板中的第二孔中。 所述散热片具有(i)第一端,其构造成当所述第一锚固件插入所述电路板中的所述第一孔中时固定到所述第一锚固件,(ii)第二端构造成当所述第二锚固件 插入到电路板的第二孔中,以及(iii)中间部分,被构造成在与向上方向大致相反的向下方向上的散热器上提供力。

    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
    5.
    发明授权
    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board 有权
    使用从电路板的下侧安装的锚固件将散热器附接到电路板的技术

    公开(公告)号:US07321493B2

    公开(公告)日:2008-01-22

    申请号:US11079810

    申请日:2005-03-14

    IPC分类号: H05K7/20

    摘要: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

    摘要翻译: 改进的散热器连接组件包括被配置为固定到电路板的第一位置的第一锚固件和被配置成固定到电路板的第二位置的第二锚固件。 每个锚杆包括腿部,腿部具有被配置为接触电路板的环形端部。 散热器连接组件还包括散热夹,该散热夹构造成当锚固件固定到电路板上时同时(i)固定到锚固件,以及(ii)将散热片固定在电路板的电路板部件上。 腿的环形端部防止腿部完全穿过限定在电路板中的孔。 在一些情况下,环形端部限定用于与电路板的鲁棒干涉配合以及用于增强强度和稳定性的延伸线圈(例如,双环)。

    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
    6.
    发明申请
    Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board 有权
    使用从电路板的下侧安装的锚固件将散热器附接到电路板的技术

    公开(公告)号:US20060114658A1

    公开(公告)日:2006-06-01

    申请号:US11001411

    申请日:2004-12-01

    IPC分类号: H05K7/20

    摘要: A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.

    摘要翻译: 散热器附接组件包括第一锚固件,第二锚固件和散热片夹具。 第一锚定构造成从电路板的下侧向电路板的上侧向上方插入电路板的第一孔。 类似地,第二锚定构件沿向上方向插入电路板中的第二孔中。 所述散热片具有(i)第一端,其构造成当所述第一锚固件插入所述电路板中的所述第一孔中时固定到所述第一锚固件,(ii)第二端构造成当所述第二锚固件 插入到电路板的第二孔中,以及(iii)中间部分,被构造成在与向上方向大致相反的向下方向上的散热器上提供力。