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公开(公告)号：US20150313045A1
公开(公告)日：2015-10-29
申请号：US14791726
申请日：2015-07-06
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Jie Zou , Hao Sun , Mingxing Yang
CPC classification number: H05K9/0049 , B29C45/14639 , B29K2995/0005 , B29L2031/3481 , G06F1/1656 , G06F1/182 , H05K9/0022 , H05K9/0081
Abstract: An electronic device includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.
Abstract translation: 电子设备包括金属构件，电路板和屏蔽构件。 通孔或槽设置在金属构件上。 屏蔽部件固定在金属部件上。 屏蔽构件包括阻挡部分和封闭部分。 阻挡部分由导电塑料材料制成。 封闭部分由金属材料或导电塑料材料制成。 阻挡部分被构造成阻挡通孔或槽。 封闭部分围绕电子部件设置。 封闭部分的一端电连接到金属部件，封闭部分的另一端电连接到电路板。 金属构件，阻挡部分，封闭部分和电路板形成屏蔽空间，并且电子部件位于屏蔽空间中。
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公开(公告)号：US09807918B2
公开(公告)日：2017-10-31
申请号：US14791726
申请日：2015-07-06
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Jie Zou , Hao Sun , Mingxing Yang
CPC classification number: H05K9/0049 , B29C45/14639 , B29K2995/0005 , B29L2031/3481 , G06F1/1656 , G06F1/182 , H05K9/0022 , H05K9/0081
Abstract: An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.
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