公开(公告)号：US20250070070A1

公开(公告)日：2025-02-27

申请号：US18945986

申请日：2024-11-13

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Mirko BERNARDONI ,  Lasse Petteri PALM ,  Gilberto CURATOLA

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L25/18

Abstract: The present disclosure is related to the field of semiconductor devices and packaging, and to heat transfer in a semiconductor package. The present disclosure provides a semiconductor package and a method for fabricating the semiconductor packet. The semiconductor package comprises a semiconductor device, a heat sink, and a plurality of vias. The plurality of vias is arranged between the semiconductor device and the heat sink to transfer heat from the semiconductor device to the heat sink. The plurality of vias further forms a non-uniform distribution of vias over the device face.