公开(公告)号：US20250015017A1

公开(公告)日：2025-01-09

申请号：US18890724

申请日：2024-09-19

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Eckart Hoene ,  Luise Pawlak ,  Ming Wu ,  Xiaofeng Xu ,  Zhengyan He

IPC: H01L23/62 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18

Abstract: A semiconductor device includes a package body, a chip, a redistribution layer, and a conductive hot melt layer. The chip, the redistribution layer, and the conductive hot melt layer are all packaged in the package body. The redistribution layer includes a first conductive pad and a second conductive pad that are disposed at an interval from each other and insulated from each other, wherein a part of the redistribution layer other than the first conductive pad and the second conductive pad is connected to a pin of the chip; and the conductive hot melt layer is formed on a surface of the first conductive pad and a surface of the second conductive pad, and is in electrical contact with both the first conductive pad and the second conductive pad.