-
公开(公告)号：US20230097153A1
公开(公告)日：2023-03-30
申请号：US18071358
申请日：2022-11-29
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Zhengyan He , Jiebin Cheng , Chao Wu
Abstract: This application discloses a switched-inductor power converter, a communication system, and a method. The switched-inductor power converter includes a coupling winding and a unidirectional conduction circuit, and the coupling winding and the unidirectional conduction circuit are connected in series to form a closed loop. A leakage inductor is formed after the coupling winding and a power inductor are magnetically coupled. Existence of the leakage inductor and the unidirectional conduction circuit may suppress a reverse recovery stress of a first diode, to further reduce a reverse recovery current of the first diode, and reduce a reverse recovery loss of the first diode.
-
公开(公告)号：US11784552B2
公开(公告)日：2023-10-10
申请号：US17858821
申请日：2022-07-06
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Zhengyan He , Jiebin Cheng , Qinghai Wang , Yuliang Lu
CPC classification number: H02M1/0051 , H02M1/00 , H02M3/156 , H02M3/24 , H04W88/08
Abstract: Embodiments of the present disclosure disclose a power converter and a related system. The power converter includes a controller and a power conversion circuit. The power conversion circuit is configured to convert an input power of an input power supply into an output power of a load, where the input power supply is an external power supply connected to the power converter. The controller is configured to control on/off of the first switch element, to implement connection/disconnection between the input power supply and the inductive element; and control the unidirectional conduction circuit to be turned on before the first switch element is turned on in the power conversion cycle.
-
3.发明申请公开(公告)号：US20250015017A1
公开(公告)日：2025-01-09
申请号：US18890724
申请日：2024-09-19
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Eckart Hoene , Luise Pawlak , Ming Wu , Xiaofeng Xu , Zhengyan He
Abstract: A semiconductor device includes a package body, a chip, a redistribution layer, and a conductive hot melt layer. The chip, the redistribution layer, and the conductive hot melt layer are all packaged in the package body. The redistribution layer includes a first conductive pad and a second conductive pad that are disposed at an interval from each other and insulated from each other, wherein a part of the redistribution layer other than the first conductive pad and the second conductive pad is connected to a pin of the chip; and the conductive hot melt layer is formed on a surface of the first conductive pad and a surface of the second conductive pad, and is in electrical contact with both the first conductive pad and the second conductive pad.
-
公开(公告)号：US11437904B2
公开(公告)日：2022-09-06
申请号：US17112571
申请日：2020-12-04
Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
Inventor： Zhengyan He , Jiebin Cheng , Qinghai Wang , Yuliang Lu
Abstract: Embodiments of the present disclosure disclose a power converter and a related system. The power converter includes a controller and a power conversion circuit. The power conversion circuit is configured to convert an input power of an input power supply into an output power of a load, where the input power supply is an external power supply connected to the power converter. The controller is configured to control on/off of the first switch element, to implement connection/disconnection between the input power supply and the inductive element; and control the unidirectional conduction circuit to be turned on before the first switch element is turned on in the power conversion cycle.
-
-
-
Search Results
4
records
(took 0.019 seconds)
