公开(公告)号：US20250014964A1

公开(公告)日：2025-01-09

申请号：US18891135

申请日：2024-09-20

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Andreas MUNDING ,  Yumin Liu ,  Lasse Petteri Palm

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

Abstract: A hybrid bond sheet for mounting a semiconductor power module to a heat sink includes a thermally conductive core layer having an upper main face and a lower main face; a first bond layer formed at the upper main face of the core layer for bonding the hybrid bond sheet to a semiconductor power module; and a second bond layer formed at the lower main face of the core layer for bonding the hybrid bond sheet to a heat sink; where the core layer is subdivided into a plurality of core metal sections and core polymer sections which are formed side-by-side between the upper main face and the lower main face, the subdivided core metal sections being configured to enable a uniform heat transfer between the semiconductor power module and the heat sink and to reduce thermal stress at interfaces between the hybrid bond sheet and the heat sink.

公开(公告)号：US20250046682A1

公开(公告)日：2025-02-06

申请号：US18885912

申请日：2024-09-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Andreas MUNDING ,  Lasse Petteri Palm ,  Yumin Liu

IPC: H01L23/488 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/10

Abstract: A hybrid bond sheet for bonding a first joining member to a second joining member, including: a core layer including: a core insulating layer formed between an upper main face and a lower main face of the core layer; and one or more metallic through-connections penetrating the core insulating layer from the upper main face to the lower main face. The hybrid bond sheet includes a first bonding layer with a first insulating bond layer and a first metal bond layer for bonding the first joining member. The hybrid bond sheet includes a second bonding layer with a second insulating bond layer and a second metal bond layer for bonding the second joining member. The one or more metallic through-connections and the first and second metal bond layers are configured to form an electrically and thermally conductive connection with the first joining member and the second joining member.