公开(公告)号：US20240389282A1

公开(公告)日：2024-11-21

申请号：US18660539

申请日：2024-05-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Maofan Li ,  Zhibing Yang ,  Faming Sun

IPC: H05K7/20 ,  H01L23/427

Abstract: A top-mounted heat dissipation photovoltaic inverter device includes an inverter module and a top-mounted heat dissipation module. The top-mounted heat dissipation module includes a top-installed heat dissipation assembly and a back-mounted heat dissipation assembly. The top-installed heat dissipation assembly includes a condenser and a fan assembly. The back-mounted heat dissipation assembly includes an evaporator and an air-cooled heat sink. The condenser and the box are arranged in a laminated manner in a first direction. The condenser and the fan assembly are arranged adjacently in a second direction. The box, the evaporator, and the air-cooled heat sink are arranged sequentially and adjacently in the second direction. A projection of the top-installed heat dissipation assembly does not overlap with a projection of the back-mounted heat dissipation assembly in a third direction.