公开(公告)号：US20230164962A1

公开(公告)日：2023-05-25

申请号：US18158286

申请日：2023-01-23

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Faming Sun ,  Quanming Li ,  Jun Chen

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20936 ,  H05K7/20409

Abstract: A heat dissipation apparatus or an inverter, includes a main heat sink, an extra heat sink, and a heat conducting element, the main heat sink includes a main substrate and a main fin, one end of the main fin is connected to the main substrate, the extra heat sink is located at an end of the main fin farther from the main substrate, the extra heat sink is detachably connected to the main heat sink, and the heat conducting element extends from the main substrate to the extra heat sink, to transfer heat between the main substrate and the extra heat sink. In this application, the heat dissipation apparatus is designed as a split structure. A dual heat dissipation function of the main heat sink and the extra heat sink improves a heat dissipation capability of the heat dissipation apparatus, and improves heat dissipation efficiency.

公开(公告)号：US20240090184A1

公开(公告)日：2024-03-14

申请号：US18514758

申请日：2023-11-20

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiufeng Zhang ,  Faming Sun ,  Binqing Xu

IPC: H05K7/20 ,  H05K5/02

CPC classification number: H05K7/20909 ,  H05K5/0213

Abstract: This application discloses a power distribution cabinet which includes a cabinet body, a first air duct assembly, and a second air duct assembly. The first air duct assembly is disposed outside the cabinet body, and the first air duct assembly is disposed on the first side wall of the cabinet body. A projection of the first air duct assembly on the first side wall covers the first air vent and the second air vent. A first circulation space is formed between the first air duct assembly and the first side wall. The first circulation space communicates with an internal space of the cabinet body through the first air vent and the second air vent. The second air duct assembly is disposed inside the cabinet body, and the second air duct assembly forms a second circulation space. The second circulation space communicates with the first air vent.

公开(公告)号：US20240389282A1

公开(公告)日：2024-11-21

申请号：US18660539

申请日：2024-05-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Maofan Li ,  Zhibing Yang ,  Faming Sun

IPC: H05K7/20 ,  H01L23/427

Abstract: A top-mounted heat dissipation photovoltaic inverter device includes an inverter module and a top-mounted heat dissipation module. The top-mounted heat dissipation module includes a top-installed heat dissipation assembly and a back-mounted heat dissipation assembly. The top-installed heat dissipation assembly includes a condenser and a fan assembly. The back-mounted heat dissipation assembly includes an evaporator and an air-cooled heat sink. The condenser and the box are arranged in a laminated manner in a first direction. The condenser and the fan assembly are arranged adjacently in a second direction. The box, the evaporator, and the air-cooled heat sink are arranged sequentially and adjacently in the second direction. A projection of the top-installed heat dissipation assembly does not overlap with a projection of the back-mounted heat dissipation assembly in a third direction.