公开(公告)号：US12089376B2

公开(公告)日：2024-09-10

申请号：US17848520

申请日：2022-06-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Guidong Song

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/2049

Abstract: A heat dissipation device includes a fixing bracket and a plurality of heat sinks, where the fixing bracket includes a mounting part, and a plurality of first mounting holes are provided on the mounting part; and a fixing part is disposed on each of the plurality of heat sinks, and the fixing part is inserted into the first mounting hole. A height of the fixing part above a surface of the heat sink along a direction perpendicular to the heat sink is greater than a thickness of the fixing bracket, and the fixing part fits a gap of the first mounting hole. Floating gaps are reserved for the heat sink both in a mounting direction between the heat sink and the fixing bracket and in an aperture direction of the first mounting hole, so as to reduce a risk of a damage to a chip that is not fastened with the heat sink.

公开(公告)号：US20210327783A1

公开(公告)日：2021-10-21

申请号：US17360594

申请日：2021-06-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guidong Song ,  Yiwei Fan

IPC: H01L23/40 ,  H01L23/36

Abstract: A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.