公开(公告)号：US20250076036A1

公开(公告)日：2025-03-06

申请号：US18948756

申请日：2024-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hai Chen ,  Xiaowei Wang ,  Wei Geng

IPC: G01B11/25

Abstract: A three-dimensional (3D) information measurement apparatus includes: a light source module, an event awareness module, and a processing module. The light source module is configured to project at least two speckle images onto a target object, and measurement depths corresponding to any two of the at least two speckle images are different. The event awareness module is configured to collect speckle images obtained through reflection of the at least two speckle images by the target object, to obtain a plurality of event images. The processing module is configured to determine 3D information of the target object based on the plurality of event images.

公开(公告)号：US20130221537A1

公开(公告)日：2013-08-29

申请号：US13754515

申请日：2013-01-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： HuiLi Fu ,  Ting Lei ,  Xiaowei Wang ,  Nan Zhao

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/50 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device is provided in the present invention. The semiconductor device includes a silicon substrate, configured to bear a chip; a power management module arranged inside the silicon substrate, configured to convert a power supply voltage to an input voltage required by the chip; and an interconnecting system, configured to receive the power supply voltage, transmit the power supply voltage to the power management module, and transmit the input voltage to the chip. With the semiconductor device according to the embodiments of the present invention, the power supply voltage can be directly sent from the silicon substrate to the chip after being generated, thereby shortening the power supply link and reducing the power supply/ground noise.

Abstract translation: 在本发明中提供半导体器件。 半导体器件包括被配置为承载芯片的硅衬底; 布置在所述硅衬底内的电源管理模块，被配置为将电源电压转换为所述芯片所​​需的输入电压; 以及互连系统，被配置为接收电源电压，将电源电压发送到电源管理模块，并将输入电压传送到芯片。 利用根据本发明的实施例的半导体器件，可以在生成之后将电源电压从硅衬底直接发送到芯片，从而缩短电源链路并降低电源/接地噪声。