公开(公告)号：US11960532B2

公开(公告)日：2024-04-16

申请号：US18169017

申请日：2023-02-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ping Zhang ,  Wei Su ,  Ling Deng ,  Ting Lei

IPC: G06F16/583 ,  G06F16/54 ,  G06F16/55

CPC classification number: G06F16/583 ,  G06F16/54 ,  G06F16/55

Abstract: An image management method includes: after a video stream sent by a camera is obtained, recognizing a face image in the video stream through face recognition; comparing the image with a face image that is in an area in which the camera is located in a database; and if the comparison fails, expanding the area in which the camera is located around, and then comparing the face image with face images in an area obtained after the area in which the camera is located is expanded.

公开(公告)号：US20230195779A1

公开(公告)日：2023-06-22

申请号：US18169017

申请日：2023-02-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ping Zhang ,  Wei Su ,  Ling Deng ,  Ting Lei

IPC: G06F16/583 ,  G06F16/55 ,  G06F16/54

CPC classification number: G06F16/583 ,  G06F16/55 ,  G06F16/54

Abstract: An image management method includes: after a video stream sent by a camera is obtained, recognizing a face image in the video stream through face recognition; comparing the image with a face image that is in an area in which the camera is located in a database; and if the comparison fails, expanding the area in which the camera is located around, and then comparing the face image with face images in an area obtained after the area in which the camera is located is expanded. .

公开(公告)号：US12294813B2

公开(公告)日：2025-05-06

申请号：US17350205

申请日：2021-06-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ting Lei ,  Chao Zou

IPC: H04N7/18 ,  G06T1/20 ,  G06T1/60 ,  G06T5/50 ,  G06T7/33 ,  G06V10/40 ,  G06V10/74 ,  G06V20/52

Abstract: A distributed image analysis method performed by a distributed image analysis system comprising a plurality of first servers and a second server. The distributed image analysis method includes: obtaining, by each of the plurality of first servers, a result set through image collision analysis, where the result set includes an index image that records a result object, the index image corresponds to an object frequency; separately sending, by each of the plurality of first servers, a result set to the second server; performing, by the second server, feature extraction on the index image in each of the result sets received from the plurality of first servers, to obtain a feature value of the index image; performing, by the second server, image collision analysis on the extracted feature value of the index image in each of the result sets, to obtain a confidence of the index image; and when determining that a confidence between the index images in the result sets received from the plurality of first servers is greater than or equal to a preset value, obtaining, by the second server, a sum of object frequencies corresponding to the index images.

公开(公告)号：US20130221537A1

公开(公告)日：2013-08-29

申请号：US13754515

申请日：2013-01-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： HuiLi Fu ,  Ting Lei ,  Xiaowei Wang ,  Nan Zhao

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/50 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device is provided in the present invention. The semiconductor device includes a silicon substrate, configured to bear a chip; a power management module arranged inside the silicon substrate, configured to convert a power supply voltage to an input voltage required by the chip; and an interconnecting system, configured to receive the power supply voltage, transmit the power supply voltage to the power management module, and transmit the input voltage to the chip. With the semiconductor device according to the embodiments of the present invention, the power supply voltage can be directly sent from the silicon substrate to the chip after being generated, thereby shortening the power supply link and reducing the power supply/ground noise.

Abstract translation: 在本发明中提供半导体器件。 半导体器件包括被配置为承载芯片的硅衬底; 布置在所述硅衬底内的电源管理模块，被配置为将电源电压转换为所述芯片所​​需的输入电压; 以及互连系统，被配置为接收电源电压，将电源电压发送到电源管理模块，并将输入电压传送到芯片。 利用根据本发明的实施例的半导体器件，可以在生成之后将电源电压从硅衬底直接发送到芯片，从而缩短电源链路并降低电源/接地噪声。