HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

    公开(公告)号:US20250081400A1

    公开(公告)日:2025-03-06

    申请号:US18952091

    申请日:2024-11-19

    Abstract: A heat dissipation apparatus, a connection structure, and an electronic device. A first heat sink is in thermal contact with a first heat-generating device on a first component, and a second heat sink is in thermal contact with a second heat-generating device on a second component. The first heat sink and the second heat sink are communicated through a pipeline (120), and the three are filled with a cooling medium. Heat generated by either of the first heat-generating device and the second heat-generating device may be transferred to the cooling medium in the heat sink through the corresponding heat sink, and the heat is dissipated outward through a surface of the heat sink.

    OPTICAL LINK FAULT IDENTIFICATION METHOD, APPARATUS AND SYSTEM

    公开(公告)号:US20220407596A1

    公开(公告)日:2022-12-22

    申请号:US17892886

    申请日:2022-08-22

    Abstract: This application provides an optical link fault identification method, and relate to the field of communications technologies. The method includes: obtaining performance data of a network device, extracting a feature parameter of the performance data, and identifying a fault mode on an optical link based on the feature parameter. The method resolves problems of a difficulty in fault identification and slow troubleshooting that are caused by a large quantity of devices, many line faults, and a difficulty in obtaining manual troubleshooting cases. In addition, a fault can be quickly identified when the fault occurs, improving troubleshooting efficiency. When an optical link risk does not cause a fault, deterioration of the performance data can be found in advance based on a feature, to perform identification and warning.

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