公开(公告)号：US20250081400A1

公开(公告)日：2025-03-06

申请号：US18952091

申请日：2024-11-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhi HE ,  Chunrong LI ,  Baojun YUAN ,  Zhao ZHANG

IPC: H05K7/20

Abstract: A heat dissipation apparatus, a connection structure, and an electronic device. A first heat sink is in thermal contact with a first heat-generating device on a first component, and a second heat sink is in thermal contact with a second heat-generating device on a second component. The first heat sink and the second heat sink are communicated through a pipeline (120), and the three are filled with a cooling medium. Heat generated by either of the first heat-generating device and the second heat-generating device may be transferred to the cooling medium in the heat sink through the corresponding heat sink, and the heat is dissipated outward through a surface of the heat sink.