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公开(公告)号:US20250081400A1
公开(公告)日:2025-03-06
申请号:US18952091
申请日:2024-11-19
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Zhi HE , Chunrong LI , Baojun YUAN , Zhao ZHANG
IPC: H05K7/20
Abstract: A heat dissipation apparatus, a connection structure, and an electronic device. A first heat sink is in thermal contact with a first heat-generating device on a first component, and a second heat sink is in thermal contact with a second heat-generating device on a second component. The first heat sink and the second heat sink are communicated through a pipeline (120), and the three are filled with a cooling medium. Heat generated by either of the first heat-generating device and the second heat-generating device may be transferred to the cooling medium in the heat sink through the corresponding heat sink, and the heat is dissipated outward through a surface of the heat sink.