公开(公告)号：US3775579A

公开(公告)日：1973-11-27

申请号：US3775579D

申请日：1972-05-30

Applicant: IBM

Inventor： BURGHART A ,  HOUSER D ,  KIEFFER J ,  WALLACE G

IPC: B23K11/00 ,  H05K3/22 ,  H05K3/32 ,  B23K1/02

CPC classification number: B23K11/0046 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49718

Abstract: A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.

Abstract translation: 一种用于修复印刷电路板上的印刷电路线中的开放或空隙的方法和装置，其中板被定位成在接合头下方开放，并且金属带材料被定位在接合到电路线上的开放的热压缩上 一侧打开，切割长度，然后热压接在电路线的另一侧开放。