公开(公告)号：US10080285B2

公开(公告)日：2018-09-18

申请号：US15150234

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

公开(公告)号：US20180063955A1

公开(公告)日：2018-03-01

申请号：US15406360

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Charles W. WERLEY ,  Haran BALARAM ,  Richard L. WINSLOW

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/181 ,  H05K3/328 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2203/107

Abstract: An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the through hole. In order to electrically couple the circuit board to the battery, and in particular, an electrode of the battery, a tab (or plaque) is placed between the electrical pad and the electrode. The tab electrically couples with the electrical pad by a soldering operation. To couple (electrically and mechanically) the tab with the electrode, a welding operation is used. The welding operation may include a laser weld providing thermal energy through a laser beam. In this regard, the laser beam passes through the through hole, thereby (partially) melting the tab and forming a weld between the tab and the electrode. Accordingly, the tab covers the through hole such that the tab is positioned to receive the laser beam.

公开(公告)号：US20170301464A1

公开(公告)日：2017-10-19

申请号：US15482836

申请日：2017-04-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yosuke TERASHITA

IPC: H01G4/008 ,  H05K1/18 ,  H01G4/248 ,  H01G4/12 ,  H01G4/30 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01G4/008 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/09 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer-ceramic-capacitor mounting structure includes a circuit board and a multilayer ceramic capacitor. First and second external electrodes include first and second conductive resin layers on surfaces of first and second base electrode layers, respectively. The circuit board includes a copper plate on a surface of a core, disposed as a wiring pattern, and including a predetermined thickness, and signal electrodes disposed on a surface of the copper plate. The first and second external electrodes are each electrically connected to the signal electrodes of the copper plate.

公开(公告)号：US09711780B2

公开(公告)日：2017-07-18

申请号：US14535897

申请日：2014-11-07

Applicant: LG CHEM, LTD.

Inventor： Youngsun Park ,  Jeongsuk Lee ,  Keunpyo Ahn ,  Chunyeon Kim ,  Joung Ho Ha ,  Masayuki Wakebe

IPC: H01M14/00 ,  H01M2/34 ,  H01M2/04 ,  H01M10/0525 ,  H01M10/42 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: A battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell. The PCM includes a protection circuit board (PCB) electrically connected to the battery cell, the PCB being provided on a region where a circuit is connected with a conductive pattern including a fusing part, having relatively high resistance, configured to fuse itself for interrupting the flow of current when a large amount of current is conducted.

公开(公告)号：US20170117604A1

公开(公告)日：2017-04-27

申请号：US15331677

申请日：2016-10-21

Applicant: KYOCERA Document Solutions Inc.

Inventor： Yuichiro Kurokawa

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H01P3/08 ,  H01P3/02 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1572

Abstract: A signal transmission path includes a first cable, a second cable, and an interval regulation member. The first cable includes a plurality of signal lines arranged in parallel along one direction. The second cable includes a plurality of signal lines arranged in parallel along the one direction, and is laminated with the first cable. The interval regulation member forms a predetermined specific interval between the first cable and the second cable in a lamination direction in which the first cable and the second cable are laminated.

公开(公告)号：US09606496B2

公开(公告)日：2017-03-28

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/00 ,  G03G15/00 ,  H05K3/40 ,  H05K1/02 ,  H05K3/34

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

公开(公告)号：US20170006711A1

公开(公告)日：2017-01-05

申请号：US15106634

申请日：2014-11-10

Applicant: ROBERT BOSCH GMBH

Inventor： Uwe Liskow

IPC: H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

Abstract translation: 电子控制模块包括印刷电路板和电气部件。 电路板具有布置在部件侧的接触区域。 电气部件具有电连接元件，其连接部分平行于部件侧延伸并且电连接到接触区域。 电路板上独立于电气部件设置适配器，并且具有在接触区域外部紧固到电路板的保持体和金属网。 卷筒纸布置在保持体上，并且具有平行于部件侧延伸的接触部分。 接触部分和连接部分位于另一个顶部并且在覆盖区域中彼此焊接。 网或连接元件通过施加到接触区域的导电材料与接触区域电接触。

公开(公告)号：US09518887B2

公开(公告)日：2016-12-13

申请号：US14989332

申请日：2016-01-06

Applicant: KULITE SEMICONDUCTOR PRODUCTS, INC.

Inventor： Louis DeRosa ,  Robert Gardner

IPC: H05K1/00 ,  H05K1/18 ,  G01L19/14 ,  H05K1/02 ,  G01L15/00 ,  H05K7/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/189 ,  G01L15/00 ,  G01L19/14 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

公开(公告)号：US20160204675A1

公开(公告)日：2016-07-14

申请号：US14994493

申请日：2016-01-13

Applicant: NANJING CHERVON INDUSTRY CO., LTD.

Inventor： Dezhong Yang ,  Pingbo Shi ,  Jifeng Feng

IPC: H02K7/14 ,  H02K11/33 ,  H02K11/30 ,  H02K3/28 ,  H05K1/18 ,  H05K1/02

CPC classification number: H02K7/145 ,  H02K11/33 ,  H05K1/0263 ,  H05K3/202 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power tool and a printed circuit board for use therewith. The power tool has an electric motor and a power source. The printed circuit board assembly has a main board having a conductive portion, a semiconductor power device, and a conductor attached to the conductive portion. The conductive portion electrically connects to the semiconductor power device and the conductor electrically connects to the conductive portion. When current is flowing through the printed circuit board, the heat and the voltage loss generated by the printed circuit board can be reduced.

Abstract translation: 电动工具和与其一起使用的印刷电路板。 电动工具具有电动马达和电源。 印刷电路板组件具有导电部分的主板，半导体功率器件和连接到导电部分的导体。 导电部分电连接到半导体功率器件，并且导体电连接到导电部分。 当电流流过印刷电路板时，可以减少由印刷电路板产生的热量和电压损失。

公开(公告)号：US09360378B2

公开(公告)日：2016-06-07

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: H05K7/00 ,  G01K11/26 ,  H05K1/02 ,  B23K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/34

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical device includes a first electrical component and a second electrical component connected to each other via an electrical connection having an electrically insulating support plate and a weld joint deposited on the support plate. The weld joint has a melting temperature (Ta) significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection are subjected. The electrical device includes cement that completely covers the exposed weld joint. The material of the cement is chosen to maintain its adhesion and its tightness with respect to the weld joint when the Ta is applied.

Abstract translation: 电气设备包括通过电连接彼此连接的第一电气部件和第二电气部件，该电气连接具有电绝缘支撑板和沉积在支撑板上的焊接接头。 焊接接头具有明显低于两个电气部件和电连接中的至少一个所承受的环境工作温度（Ta）的熔化温度（Ta）。 电气设备包括完全覆盖暴露的焊接接头的水泥。 当施加Ta时，选择水泥的材料以保持其粘合性和相对于焊接接头的密封性。