公开(公告)号：US3871014A

公开(公告)日：1975-03-11

申请号：US85009369

申请日：1969-08-14

Applicant: IBM

Inventor： KING WILLIAM J ,  WILCOX DAVID L

IPC: H01L21/60 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L24/16 ,  H01L24/12 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/1701 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/49144 ,  H01L2924/00012

Abstract: The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions on the substrate. Smaller solder wettable regions cause the solder connectors to increase chip substrate standoff thereby relieving the stress on the remaining joints.

Abstract translation: 半导体芯片和基板之间的互连接头的形状不均匀。 接头是焊料并且由于衬底上的焊料可润湿区域的尺寸变化而具有变化的形状。 较小的焊料可润湿区域导致焊料连接器增加芯片基板间隙，从而缓解其余接头处的应力。