公开(公告)号：US3658088A

公开(公告)日：1972-04-25

申请号：US3658088D

申请日：1970-06-17

Applicant: IBM

Inventor： JENSEN DONALD F ,  RICKENBACH DAVID H ,  SCHAFFER ROBERT R

IPC: F15B13/00 ,  F15B13/08 ,  F15C5/00

CPC classification number: F15B13/081 ,  F15B13/0814 ,  F15B13/0871 ,  F15B13/0896 ,  Y10T137/2224 ,  Y10T137/8593 ,  Y10T137/85938 ,  Y10T137/87885

Abstract: The basic device for connecting fluid logic circuits comprises a base plate, a sealing film, a back seal plate, a circuit plate, a front seal plate and a gasket adapted to have a plurality of logic modules mounted thereon. The front seal plate is perforated to provide for connection of every possible logic input and output to the circuit plate which is provided with perforations and interconnecting channels for the required hole-to-hole connections. The back seal plate seals the channels and is perforated to allow communication with input and output lines. The seal film is perforated only at selected locations and the base plate is completely perforated with holes adapted to accept terminals for the input and output tubing connections.

Abstract translation: 用于连接流体逻辑电路的基本装置包括基板，密封膜，背面密封板，电路板，前密封板和适于安装有多个逻辑模块的垫片。 前密封板是穿孔的，用于将每个可能的逻辑输入和输出连接到电路板，该电路板设置有用于所需孔到孔连接的穿孔和互连通道。 后密封板密封通道并穿孔以允许与输入和输出线路通信。 密封膜仅在选定位置穿孔，底板完全穿孔，适用于接收输入和输出管道连接的端子。