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1.发明授权Cathodic sputtering apparatus including thermionic means for increasing sputtering efficiency 失效阴极溅射装置包括用于提高溅射效率的热离子装置
公开(公告)号：US3369990A
公开(公告)日：1968-02-20
申请号：US42266764
申请日：1964-12-31
Applicant: IBM
Inventor： HALLEN ROBERT L , VALLETTA ROBERT M
CPC classification number: C23C14/345 , C23C14/3471 , C23C14/35 , C23F4/00 , H01J37/34
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2.发明授权Method and apparatus for cathode sputtering including suppressing temperature rise adjacent the anode using a localized magnetic field 失效用于阴极溅射的方法和装置包括使用局部磁场抑制邻近阳极的温度升高
公开(公告)号：US3330752A
公开(公告)日：1967-07-11
申请号：US42267764
申请日：1964-12-31
Applicant: IBM
Inventor： HALLEN ROBERT L , VALLETTA ROBERT M
CPC classification number: C23C14/35 , C23C14/541 , G01N15/088 , H01J37/3402
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