公开(公告)号：US20180183581A1

公开(公告)日：2018-06-28

申请号：US15393179

申请日：2016-12-28

Applicant: INTEL CORPORATION

Inventor： REOUVEN ELBAZ ,  DANIEL NEMIROFF ,  WILLIAM STEVENS, JR.

IPC: H04L9/08 ,  H04L29/06 ,  H04W12/06

CPC classification number: H04L63/0442 ,  G06F15/7807 ,  G06F2213/0038 ,  G09C1/00 ,  H04L9/0825 ,  H04L63/0435 ,  H04L63/061 ,  H04L2209/72

Abstract: Various embodiments for providing datalink security in a datalink between a first hardware device (e.g., a system-on-a-chip (SoC) device) and a second hardware device (e.g., an encrypted storage device) are described. Various embodiments using differing types of keys and setups are described and claimed.