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1.
公开(公告)号:US20200043694A1
公开(公告)日:2020-02-06
申请号:US16485084
申请日:2018-02-12
Applicant: IONICS FRANCE
Inventor: Denis Busardo , Frédéric Guernalec
IPC: H01J37/08 , G02B1/113 , H01J37/317
Abstract: Process for treatment of a sapphire part with a beam of a mixture of mono- and multicharged ions of a gas which are produced by an electron cyclotron resonance (ECR) source, where: the voltage for acceleration of the ions is between 10 kV and 100 kV; the implanted dose, expressed in ions/cm2, is between (5×1016)×(M/14)−1/2 and 1017×(M/14)−1/2, where M is the atomic mass of the ion; the rate of displacement VD, expressed in cm/s, is between 0.025×(P/D) and 0.1×(P/D), where P is the power of the beam, expressed in W (watts), and D is the diameter of the beam, expressed in cm (centimetres). A part made of sapphire having a high transmittance and which is resistant to scratching is thus advantageously obtained.
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公开(公告)号:US10923310B2
公开(公告)日:2021-02-16
申请号:US16485084
申请日:2018-02-12
Applicant: IONICS FRANCE
Inventor: Denis Busardo , Frédéric Guernalec
IPC: H01J37/08 , G02B1/113 , H01J37/317 , G06F3/041
Abstract: Process for treatment of a sapphire part with a beam of a mixture of mono- and multicharged ions of a gas which are produced by an electron cyclotron resonance (ECR) source, where: the voltage for acceleration of the ions is between 10 kV and 100 kV; the implanted dose, expressed in ions/cm2, is between (5×1016)×(M/14)−1/2 and 1017×(M/14)−1/2, where M is the atomic mass of the ion; the rate of displacement VD, expressed in cm/s, is between 0.025×(P/D) and 0.1×(P/D), where P is the power of the beam, expressed in W (watts), and D is the diameter of the beam, expressed in cm (centimetres). A part made of sapphire having a high transmittance and which is resistant to scratching is thus advantageously obtained.
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公开(公告)号:US20190352770A1
公开(公告)日:2019-11-21
申请号:US16482959
申请日:2018-02-02
Applicant: IONICS FRANCE
Inventor: Denis Busardo , Frédéric Guernalec
Abstract: Method of antireflection and scratch-resistant treatment of a synthetic sapphire material where the acceleration voltage of the ions is between 5 kV and 1000 kV and is chosen in order to create an implanted layer having a thickness equal to a multiple of 100 nm; the microwave-induced annealing temperatures in the implanted surface are between 800° C. and 2000° C. with annealing times of between 1 and 1000 seconds. Synthetic sapphire materials are thus advantageously obtained where the reflection on the treated face is reduced by at least half while maintaining a hardness of greater than or equal to 8.
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