公开(公告)号：US20220096019A1

公开(公告)日：2022-03-31

申请号：US17144151

申请日：2021-01-08

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Shuen-Yu Yu ,  Heng-Yin Chen

IPC: A61B5/00 ,  A61B5/389 ,  A61B5/304 ,  A61B5/313

Abstract: An electronic device for signal interference compensation is provided. The first signal line is electrically connected to the transmitter. The second signal line is electrically connected to the receiver and coupled with the first signal line. The electrode is electrically connected to the second signal line and measures a physiological signal. The processor is electrically connected to the transmitter and the receiver, and configured to: transmit, via the transmitter, an active signal to the first signal line; receive, via the receiver, a coupling signal corresponding to the active signal from the second signal line, and calculate a compensation value according to the coupling signal; and receive, via the receiver, an interfered signal corresponding to the physiological signal, and restore the physiological signal according to the compensation value and the interfered signal in response to the compensation value matching the interfered signal.

公开(公告)号：US11690571B2

公开(公告)日：2023-07-04

申请号：US16820678

申请日：2020-03-16

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Ming-Huan Yang ,  Kuang-Ching Fan

IPC: A61B5/00 ,  A61B5/0295 ,  A61B5/026

CPC classification number: A61B5/6843 ,  A61B5/002 ,  A61B5/0261 ,  A61B5/0295 ,  A61B5/6824 ,  A61B5/742 ,  A61B2560/0214

Abstract: A wristband biosensing system, a wristband biosensing apparatus, and a biological sensing method are provided. The system includes a wristband body worn on a wrist of a user, at least one physiological signal sensor, at least one deformation sensor, and a processing device coupled to the physiological signal sensor and the deformation sensor. The physiological signal sensor is disposed on the wristband body at a position corresponding to at least one sensing portion of the wrist to detect a physiological signal of each sensing portion. The deformation sensor is disposed around each physiological signal sensor to detect deformation of each sensing portion and output a deformation signal. The processing device receives the physiological signal and the deformation signal, inquires a compensation signal corresponding to the deformation signal, and corrects the physiological signal by using the compensation signal, so as to output a corrected physiological signal of each sensing portion.

公开(公告)号：US20190355713A1

公开(公告)日：2019-11-21

申请号：US16183735

申请日：2018-11-08

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Tai-Jui Wang ,  Chieh-Wei Feng ,  Yu-Hua Chung

IPC: H01L27/02 ,  H02H9/04 ,  H01L23/538

Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.

公开(公告)号：US11387230B2

公开(公告)日：2022-07-12

申请号：US16183735

申请日：2018-11-08

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Tai-Jui Wang ,  Chieh-Wei Feng ,  Yu-Hua Chung

IPC: H01L27/02 ,  H02H9/04 ,  H01L23/538 ,  H01L27/12

Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.

公开(公告)号：US20190341373A1

公开(公告)日：2019-11-07

申请号：US16027374

申请日：2018-07-05

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Tai-Jui Wang ,  Chieh-Wei Feng ,  Wei-Yuan Cheng

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/60 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.

公开(公告)号：US20210100512A1

公开(公告)日：2021-04-08

申请号：US16820678

申请日：2020-03-16

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Ming-Huan Yang ,  Kuang-Ching Fan

IPC: A61B5/00 ,  A61B5/0295 ,  A61B5/026

Abstract: A wristband biosensing system, a wristband biosensing apparatus, and a biological sensing method are provided. The system includes a wristband body worn on a wrist of a user, at least one physiological signal sensor, at least one deformation sensor, and a processing device coupled to the physiological signal sensor and the deformation sensor. The physiological signal sensor is disposed on the wristband body at a position corresponding to at least one sensing portion of the wrist to detect a physiological signal of each sensing portion. The deformation sensor is disposed around each physiological signal sensor to detect deformation of each sensing portion and output a deformation signal. The processing device receives the physiological signal and the deformation signal, inquires a compensation signal corresponding to the deformation signal, and corrects the physiological signal by using the compensation signal, so as to output a corrected physiological signal of each sensing portion.

公开(公告)号：US10950588B2

公开(公告)日：2021-03-16

申请号：US16027374

申请日：2018-07-05

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hung Yu ,  Tai-Jui Wang ,  Chieh-Wei Feng ,  Wei-Yuan Cheng

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/60 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L29/786

Abstract: A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.

公开(公告)号：US20190103360A1

公开(公告)日：2019-04-04

申请号：US15919222

申请日：2018-03-13

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Cheng-Hung Yu ,  Tai-Jui Wang ,  Chieh-Wei Feng ,  Shih-Kuang Chiu ,  Ming-Huan Yang

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31

Abstract: A flexible chip package is provided. The flexible chip package includes a first flexible substrate; a first redistribution layer disposed on the first flexible substrate; a second flexible substrate; a second redistribution layer disposed on the second flexible substrate; a semiconductor chip disposed between the first and second redistribution layers and electrically connected to at least one of the first and second redistribution layers; and a first bonding layer disposed between the first and second redistribution layers and encapsulating the semiconductor chip, wherein the first bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.