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公开(公告)号：US20190096780A1
公开(公告)日：2019-03-28
申请号：US16138697
申请日：2018-09-21
Applicant: Infineon Technologies AG
Inventor： Michael Roesner , Christoph Bergmann
Abstract: An electronic component includes an electronic chip and a magnetic phase change material configured to consume energy when changing between different magnetic phases in response to heating above a phase change temperature. The phase change material is thermally coupled with the electronic chip to thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature.
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