公开(公告)号：US20200227339A1

公开(公告)日：2020-07-16

申请号：US16737407

申请日：2020-01-08

Applicant: Infineon Technologies AG

Inventor： Stefan Schwab ,  Martin Mayer

IPC: H01L23/373 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  C08L83/04 ,  H01L21/48 ,  H01L23/495 ,  C08K7/14

Abstract: An assembly unit for coupling with an electronic chip of an electronic component is provided. The assembly unit includes a base body, and an electrically insulating and thermally conductive interface structure attached to the base body and comprising a polymer ceramic.

公开(公告)号：US11626351B2

公开(公告)日：2023-04-11

申请号：US17158234

申请日：2021-01-26

Applicant: Infineon Technologies AG

Inventor： Ivan Nikitin ,  Timo Bohnenberger ,  Andreas Grassmann ,  Martin Mayer ,  Alexander Roth ,  Franz Zollner

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/28 ,  H01L21/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L23/36 ,  H01L23/00

Abstract: A semiconductor package includes a semiconductor die, an encapsulant body of electrically insulating material that encapsulates the semiconductor die, a thermal conduction plate comprising an outer surface that is exposed from the encapsulant body, a region of thermal interface material interposed between the thermal conduction plate and the semiconductor die, the region of thermal interface material being a liquid or semi-liquid, and a barrier that is configured to prevent the thermal interface material of the region from flowing laterally across the barrier.

公开(公告)号：US20220238422A1

公开(公告)日：2022-07-28

申请号：US17158234

申请日：2021-01-26

Applicant: Infineon Technologies AG

Inventor： Ivan Nikitin ,  Timo Bohnenberger ,  Andreas Grassmann ,  Martin Mayer ,  Alexander Roth ,  Franz Zollner

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor die, an encapsulant body of electrically insulating material that encapsulates the semiconductor die, a thermal conduction plate comprising an outer surface that is exposed from the encapsulant body, a region of thermal interface material interposed between the thermal conduction plate and the semiconductor die, the region of thermal interface material being a liquid or semi-liquid, and a barrier that is configured to prevent the thermal interface material of the region from flowing laterally across the barrier