公开(公告)号：US20220114318A1

公开(公告)日：2022-04-14

申请号：US17557031

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Mark Gallina ,  Jianfang Zhu ,  Kristoffer Fleming ,  Akhllesh Rallabandi ,  Jianwei Dai

IPC: G06F30/39 ,  G01K15/00

Abstract: Methods and apparatus for in-field thermal calibration are disclosed. A disclosed example apparatus includes instructions, memory in the apparatus, and processor circuitry. The processor circuitry is to execute the instructions to determine that a system on chip (SOC) package is deployed, the SOC package deployed with a default first thermal model, in response to the determination that the SOC package is deployed, monitor at least one temperature of the SOC package from a sensor and power usage of the SOC package, calibrate a second thermal model based on the at least one temperature and the power usage, and publish the calibrated second thermal model for control of the SOC package.