公开(公告)号：US20230187331A1

公开(公告)日：2023-06-15

申请号：US17549497

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Bainye Francoise ANGOUA ,  Chelsea GROVES ,  Frank TRUONG ,  Praneeth AKKINEPALLY ,  Whitney BRYKS

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49838 ,  H01L23/49866

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes a glass core with one or more openings with one or more dies placed in the opening such that the glass core surrounds the one or more dies. One or one or more through glass via filled with conductive material such as copper electrically couple a first side of the glass core with a second side of the glass core opposite the first side. Other embodiments may be described and/or claimed.