公开(公告)号：US20220397726A1

公开(公告)日：2022-12-15

申请号：US17344213

申请日：2021-06-10

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Tolga Acikalin ,  Sushrutha Gujjula ,  Kelly Lofgreen ,  Ravindranath Mahajan ,  Chia-pin Chiu

IPC: G02B6/42 ,  F21V8/00

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.