公开(公告)号：US20190067158A1

公开(公告)日：2019-02-28

申请号：US16175712

申请日：2018-10-30

Applicant: Intel Corporation

Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Mani PRAKASH ,  Tao LIU ,  Henry C. BOSAK ,  Harvey R. KOFSTAD ,  Almanzo T. ORTIZ

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H01L23/40

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.