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公开(公告)号：US20230025921A1
公开(公告)日：2023-01-26
申请号：US17957175
申请日：2022-09-30
Applicant: Intel Corporation
Inventor： Devdatta Kulkarni , Alexey Chinkov , Brian Jarrett , Jeff King , John Gulick
IPC: H05K7/20
Abstract: Cold plates and liquid cooling systems for electronic devices are disclosed herein. An example cold plate includes a body defining a cavity. The body has an inlet opening and an outlet opening fluidically coupled to the cavity such that a fluid passageway is defined between the inlet opening and the outlet opening. The cold plate also includes metal foam in the cavity.
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