公开(公告)号：US12238892B2

公开(公告)日：2025-02-25

申请号：US17128620

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC: H05K7/20

Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US20220201889A1

公开(公告)日：2022-06-23

申请号：US17128620

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC: H05K7/20

Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US20230025921A1

公开(公告)日：2023-01-26

申请号：US17957175

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Devdatta Kulkarni ,  Alexey Chinkov ,  Brian Jarrett ,  Jeff King ,  John Gulick

IPC: H05K7/20

Abstract: Cold plates and liquid cooling systems for electronic devices are disclosed herein. An example cold plate includes a body defining a cavity. The body has an inlet opening and an outlet opening fluidically coupled to the cavity such that a fluid passageway is defined between the inlet opening and the outlet opening. The cold plate also includes metal foam in the cavity.

公开(公告)号：US09459985B2

公开(公告)日：2016-10-04

申请号：US14229679

申请日：2014-03-28

Applicant: INTEL CORPORATION

Inventor： Alexey Chinkov ,  Pavel Konev

IPC: G06F11/00 ,  G06F11/34 ,  G06F11/36 ,  G06F13/00

CPC classification number: G06F11/348 ,  G06F11/3419 ,  G06F11/3636 ,  G06F11/3648 ,  G06F13/00

Abstract: Methods and apparatuses may provide for tracing the performance of BIOS from the start of its execution. A hardware device such as a hardware probe may be connected to the processor on a target board and used to gather and transfer data to a host computer without resort to a COM port.

Abstract translation: 方法和设备可以提供从执行开始跟踪BIOS的性能。 诸如硬件探测器的硬件设备可以连接到目标板上的处理器，并用于收集和传送数据到主机而不需要使用COM端口。