公开(公告)号：US20200084880A1

公开(公告)日：2020-03-12

申请号：US16469105

申请日：2017-11-22

Applicant: Intel Corporation

Inventor： Ping Ping Ooi ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Kool Chi Ooi

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L25/065

Abstract: A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.

公开(公告)号：US20190304885A1

公开(公告)日：2019-10-03

申请号：US16279656

申请日：2019-02-19

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Kool Chi Ooi ,  Yang Liang Poh

IPC: H01L23/498 ,  H01L21/48

Abstract: A semiconductor package substrate includes an encapsulated interconnect on a land side of the substrate. The encapsulated interconnect includes an integral metallic structure that has a smaller contact end against the semiconductor package substrate, and a larger contact end for board mounting.