公开(公告)号：USD798304S1

公开(公告)日：2017-09-26

申请号：US29540604

申请日：2015-09-25

Applicant: Intel Corporation

Designer： Pei-yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Oliver Tsui ,  Tim Liu

公开(公告)号：US20170090516A1

公开(公告)日：2017-03-30

申请号：US14866742

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Pei-yang Sung ,  Ming-Che Lee ,  Oliver Tsui ,  Simon Tsai

IPC: G06F1/16 ,  H02J7/00

CPC classification number: G06F1/1632 ,  G06F1/1635 ,  G06F1/1669 ,  G06F1/1671 ,  G06F1/1681 ,  G06F1/1696 ,  H02J7/0042

Abstract: Particular embodiments described herein provide for an electronic device, that includes a main body, an interconnect attached to the main body, where the interconnect can electrically couple with different sized first housings, a hinge attached to the interconnect, where the hinge can rotatably couple the interconnect with the main body, and a porch, where the porch can accommodate different sized second housings.

公开(公告)号：USD819018S1

公开(公告)日：2018-05-29

申请号：US29540695

申请日：2015-09-25

Applicant: Intel Corporation

Designer： Simon Tsai ,  Oliver Tsui ,  Jeff Ku ,  Pei-yang Sung

公开(公告)号：USD761779S1

公开(公告)日：2016-07-19

申请号：US29513090

申请日：2014-12-26

Applicant: Intel Corporation

Designer： Simon Tsai ,  Oliver Tsui