公开(公告)号：US12061502B2

公开(公告)日：2024-08-13

申请号：US17368851

申请日：2021-07-07

申请人： Intel Corporation

发明人： Jeff Ku ,  Tin Poay Chuah ,  Howe Yin Loo ,  Chin Kung Goh ,  Yew San Lim ,  Cora Shih Wei Nien

IPC分类号： G06F1/20 ,  G06F1/16

CPC分类号： G06F1/203 ,  G06F1/1616

摘要： According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.

公开(公告)号：US20230395480A1

公开(公告)日：2023-12-07

申请号：US17834674

申请日：2022-06-07

申请人： Intel Corporation

发明人： Tin Poay Chuah ,  Jeff Ku ,  Min Suet Lim ,  Yew San Lim ,  Twan Sing Loo

IPC分类号： H01L23/498 ,  H05K3/34 ,  H01L21/48 ,  H05K1/11

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K1/115 ,  H05K2201/10734 ,  H05K2201/0154 ,  H05K2201/10303 ,  H01L21/4853

摘要： A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.

公开(公告)号：US11481001B2

公开(公告)日：2022-10-25

申请号：US17088620

申请日：2020-11-04

申请人： Intel Corporation

发明人： Chee Chun Yee ,  Tin Poay Chuah ,  Yew San Lim ,  Min Suet Lim ,  Jeff Ku

IPC分类号： G06F1/16

摘要： According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.

公开(公告)号：USD950565S1

公开(公告)日：2022-05-03

申请号：US29673000

申请日：2018-12-11

申请人： Intel Corporation

设计人： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

公开(公告)号：US10996913B2

公开(公告)日：2021-05-04

申请号：US16581593

申请日：2019-09-24

申请人： Intel Corporation

发明人： Jeff Ku ,  Shantanu Kulkarni

IPC分类号： G06F1/16 ,  G06F3/14

摘要： The present disclosure pertains to multimodal dual displays. A display apparatus comprises a first electronic display, a second electronic display, and a display attachment including a first region configured to attach to the first electronic display, a second region configured to attach to the second electronic display, and an intermediate region configured to change a distance between the first electronic display and the second electronic display. At least one releasable fastener is configured to releasably couple a first edge of the first electronic display to a second edge of the second electronic display. A second set of releasable fasteners is configured to releasably couple a third edge of the first electronic display to a fourth edge of the second electronic display when regions of the display attachment releasably detach from the displays, enabling the displays to rotate to achieve a different configuration and orientation with a different combined aspect ratio.

公开(公告)号：US20180314068A1

公开(公告)日：2018-11-01

申请号：US15582000

申请日：2017-04-28

申请人： Intel Corporation

发明人： Jeff Ku ,  Gavin Sung ,  Simon S. Yuan ,  Lance Lin ,  Jason Y. Jiang

IPC分类号： G02B27/01

摘要： A wearable computing device having a main computing element having a center portion and at least two arms and a display element operably connected to arms to enclose a region within which a body part may be inserted. Each arm may include a docking element connectable to the display element and may be configured to slide within the arm to move the display element relative to the center portion of the main computing element. A pivot arm may pivotably connect the display element to the slider arm to permit pivoting of the display element relative to the plane of the main computing element.

公开(公告)号：USD798304S1

公开(公告)日：2017-09-26

申请号：US29540604

申请日：2015-09-25

申请人： Intel Corporation

设计人： Pei-yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Oliver Tsui ,  Tim Liu

公开(公告)号：US09768553B2

公开(公告)日：2017-09-19

申请号：US14976170

申请日：2015-12-21

申请人： Intel Corporation

发明人： Gavin Sung ,  Jeff Ku ,  Lance Lin ,  Tim Liu ,  Jason Y. Jiang

IPC分类号： H01R13/64 ,  H01R13/24

CPC分类号： H01R13/64 ,  G06F1/1613 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/631 ,  H01R2201/06

摘要： In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.

公开(公告)号：US20240324144A1

公开(公告)日：2024-09-26

申请号：US18189428

申请日：2023-03-24

申请人： Intel Corporation

发明人： Juha Tapani Paavola ,  Christopher Moore ,  Jeff Ku ,  Prakash Kurma Raju

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20336 ,  G06F1/203 ,  H05K7/20154

摘要： Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

公开(公告)号：US20240314921A1

公开(公告)日：2024-09-19

申请号：US18121297

申请日：2023-03-14

申请人： Intel Corporation

发明人： Jeff Ku ,  Baomin Liu ,  Cora Nien ,  Min Suet Lim ,  Tongyan Zhai

IPC分类号： H05K1/02 ,  F16K31/50 ,  H05K7/20

CPC分类号： H05K1/0209 ,  F16K31/504 ,  H05K7/20254 ,  H05K2201/0209

摘要： Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.