公开(公告)号：US20240072419A1

公开(公告)日：2024-02-29

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20220278439A1

公开(公告)日：2022-09-01

申请号：US17739880

申请日：2022-05-09

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US12255382B2

公开(公告)日：2025-03-18

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20250158269A1

公开(公告)日：2025-05-15

申请号：US19027041

申请日：2025-01-17

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/04

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11870132B2

公开(公告)日：2024-01-09

申请号：US17739880

申请日：2022-05-09

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/1421 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.