公开(公告)号：US12255382B2

公开(公告)日：2025-03-18

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11967980B2

公开(公告)日：2024-04-23

申请号：US17393564

申请日：2021-08-04

Applicant: Intel Corporation

Inventor： Ashoke Ravi ,  Benjamin Jann ,  Satwik Patnaik

IPC: H03L7/24 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/081 ,  H04B1/04

CPC classification number: H04B1/0458 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/0816 ,  H03L7/24

Abstract: Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.

公开(公告)号：US20250105864A1

公开(公告)日：2025-03-27

申请号：US18971513

申请日：2024-12-06

Applicant: Intel Corporation

Inventor： Ashoke Ravi ,  Benjamin Jann ,  Satwik Patnaik ,  Elan Banin ,  Ofir Degani ,  Alexandros Margomenos ,  Igal Kushnir

IPC: H04B1/04 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/081 ,  H03L7/24

Abstract: Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.

公开(公告)号：US11870132B2

公开(公告)日：2024-01-09

申请号：US17739880

申请日：2022-05-09

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/1421 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US12191897B2

公开(公告)日：2025-01-07

申请号：US18401893

申请日：2024-01-02

Applicant: Intel Corporation

Inventor： Ashoke Ravi ,  Benjamin Jann ,  Satwik Patnaik

IPC: H03L7/24 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/081 ,  H04B1/04

Abstract: Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.

公开(公告)号：US20230189182A1

公开(公告)日：2023-06-15

申请号：US17549042

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Wayne Ballantyne ,  Benjamin Jann ,  Bruce Geren ,  Gregory Chance

IPC: H04W56/00 ,  H03K3/03

CPC classification number: H04W56/005 ,  H03K3/0315

Abstract: A wireless communication device can include an oscillator circuit. The oscillator circuit can include an oscillator and measurement circuitry coupled to the oscillator. The measurement circuitry can receive an output signal of the oscillator and measure oscillator error by comparing the output signal of the oscillator to a nominal frequency for an amount of time. The oscillator circuit can further include adjustment circuitry to adjust an oscillator frequency of the oscillator based on the measured oscillator error.

公开(公告)号：US20230188178A1

公开(公告)日：2023-06-15

申请号：US17549409

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Wayne Ballantyne ,  Benjamin Jann ,  Marco Bresciani ,  Wei Chen ,  Chien-Hwa Tou

IPC: H04B1/74 ,  G05F1/46 ,  H04B1/40

CPC classification number: H04B1/74 ,  G05F1/46 ,  H04B1/40 ,  H04W88/02

Abstract: A wireless communication device can include chains of circuitry, with at least one chain being a chain of transmitter circuitry to generate output radio frequency (RF) signals using baseband signals and at least one chain of receiver circuitry configured to receive RF signals. At least one chain can include a plurality of circuit blocks, a circuit block including at least one of oscillator circuitry, clocking circuitry, and phased lock loop (PLL) circuitry. The apparatus can include interconnect circuitry configured to couple one of the plurality of circuit blocks to a respective chain. Other systems, methods and apparatuses are described.

公开(公告)号：US20240137051A1

公开(公告)日：2024-04-25

申请号：US18401893

申请日：2024-01-02

Applicant: Intel Corporation

Inventor： Ashoke Ravi ,  Benjamin Jann ,  Satwik Patnaik

IPC: H04B1/04 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/081 ,  H03L7/24

CPC classification number: H04B1/0458 ,  G01R27/06 ,  H01Q3/40 ,  H03L7/0816 ,  H03L7/24

Abstract: Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.

公开(公告)号：US20240072419A1

公开(公告)日：2024-02-29

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20230199516A1

公开(公告)日：2023-06-22

申请号：US17560117

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Gregory Chance ,  Ashoke Ravi ,  Benjamin Jann ,  Paolo Madoglio

IPC: H04W16/28 ,  H04W24/10 ,  H04B7/06 ,  H04B17/318 ,  H04W36/00

CPC classification number: H04W16/28 ,  H04B7/0617 ,  H04B17/318 ,  H04W24/10 ,  H04W36/00837

Abstract: A wireless communication device can include an antenna array and processing circuitry coupled to the antenna array to segment antenna elements of an antenna array into a configurable plurality of groups of antenna elements. The circuitry can also activate analog beamforming for at least one group of the plurality of groups of antenna elements. Subsequent to enabling analog beamforming, the processing circuitry can configure digital beamforming for the at !east one group based on a criterion.