公开(公告)号：US20240292557A1

公开(公告)日：2024-08-29

申请号：US18650553

申请日：2024-04-30

Applicant: Intel Corporation

Inventor： Pharveen Parameswaran ,  Santhosh Ap ,  Poh Ling Lee ,  Prasanna Pichumani ,  Vijith Halestoph R ,  Syed Bukhari Syed Shafi ,  Anas Zakaria

IPC: H05K7/14

CPC classification number: H05K7/1405

Abstract: A surface-mounted retaining assembly is provided for retaining an electronic component. The electronic component may comprise an internal expansion card of an electronic device, and may comprise an M.2 module. The retaining assembly utilizes a spring-loaded retaining mechanism and may be bonded to a printed circuit board (PCB) via a small footprint solder pad. The retaining assembly eliminates the need for through-hole or surface-mounted standoffs, and thus increases the usable routing area on all layers. Additionally, the retaining assembly does not require a threaded component, and is suitable for low profile applications for which threaded components are infeasible.