公开(公告)号：US12250636B2

公开(公告)日：2025-03-11

申请号：US17520768

申请日：2021-11-08

Applicant: Intel Corporation

Inventor： Shailendra Singh Chauhan ,  Santhosh Ap ,  Arunthathi Chandrabose ,  Mythili Hegde

IPC: H04W52/02 ,  G06F1/26 ,  H04B7/0413 ,  H04W84/12

Abstract: A battery-powered device includes a baseband modem, configured to receive or send data according to a first operational mode, wherein the data correspond to a software application being executed on the battery-powered device; and a processor, configured to determine a resource requirement of the software application; and send a signal representing the determined resource requirement to the baseband modem; wherein the baseband modem is further configured to change from the first operational mode to a second operational mode based on the signal.

公开(公告)号：US20230384842A1

公开(公告)日：2023-11-30

申请号：US17825558

申请日：2022-05-26

Applicant: Intel Corporation

Inventor： Siva Prasad Jangili Ganga ,  Shailendra Singh Chauhan ,  Abhijith Prabha ,  Geejagaaru Krishnamurthy Sandesh ,  Santhosh Ap

IPC: G06F1/18 ,  H05K7/14 ,  G06F1/16 ,  H05K7/20

CPC classification number: G06F1/185 ,  H05K7/1422 ,  G06F1/1633 ,  H05K7/2039

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

公开(公告)号：US20240292557A1

公开(公告)日：2024-08-29

申请号：US18650553

申请日：2024-04-30

Applicant: Intel Corporation

Inventor： Pharveen Parameswaran ,  Santhosh Ap ,  Poh Ling Lee ,  Prasanna Pichumani ,  Vijith Halestoph R ,  Syed Bukhari Syed Shafi ,  Anas Zakaria

IPC: H05K7/14

CPC classification number: H05K7/1405

Abstract: A surface-mounted retaining assembly is provided for retaining an electronic component. The electronic component may comprise an internal expansion card of an electronic device, and may comprise an M.2 module. The retaining assembly utilizes a spring-loaded retaining mechanism and may be bonded to a printed circuit board (PCB) via a small footprint solder pad. The retaining assembly eliminates the need for through-hole or surface-mounted standoffs, and thus increases the usable routing area on all layers. Additionally, the retaining assembly does not require a threaded component, and is suitable for low profile applications for which threaded components are infeasible.

公开(公告)号：US12101146B2

公开(公告)日：2024-09-24

申请号：US18049651

申请日：2022-10-26

Applicant: Intel Corporation

Inventor： Santhosh Ap ,  Madhukiran Sreenivasareddy ,  Vamshi Krishna Aagiru ,  Praveen Kumar ,  Nithesha Ananda

IPC: H04B7/06 ,  H04B17/336

CPC classification number: H04B7/0608 ,  H04B17/336

Abstract: A mobile communication device including a processor configured to: retrieve a first isolation metric from a lookup table between an antenna and a first further antenna; retrieve a second isolation metric from a lookup table between the antenna and the second further antenna; determine that the second isolation metric is greater than the first isolation metric; and switch transmitting the signal from the first further antenna to the second further antenna.

公开(公告)号：US20230273891A1

公开(公告)日：2023-08-31

申请号：US17680902

申请日：2022-02-25

Applicant: Intel Corporation

Inventor： Mythili Hegde ,  Shailendra Singh Chauhan ,  Arunthathi Chandrabose ,  Santhosh Ap ,  Shashi Kant Singh

IPC: G06F13/42 ,  G06F1/3234 ,  G06F1/3296

CPC classification number: G06F13/4221 ,  G06F1/3253 ,  G06F1/3296 ,  G06F2213/0026

Abstract: An apparatus comprises a circuit board comprising a connector in or on the circuit board. The apparatus is to be coupled to a bus via the connector. The apparatus comprises first circuitry to communicate with a processor via the connector and bus, second circuitry to detect a utilization state of the first circuitry, determine, based on the detected utilization state of the first circuitry, a level of current to be conducted with the connector; and generate a signal indicating of whether the level of current exceeds a threshold current capacity of the connector, and third circuitry to select a first operational mode from among multiple operational modes. The first circuitry is to operate in any of the multiple operational modes responsive to the third circuitry. Additional circuitry may be provided to identify a voltage level capability of the apparatus and to configure voltage level shifting circuitry connected to the bus.

公开(公告)号：US20220026962A1

公开(公告)日：2022-01-27

申请号：US17484145

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Santhosh Ap ,  Madhurkiran Sreenivasa Reddy ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Vamshi Krishna Aagiru ,  Nithesha Ananda

IPC: G06F1/16 ,  H01P3/08 ,  H05K1/02

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a keyboard, and a chassis, where a portion of the chassis is between the substrate and the keyboard. A transmission line is embedded in the portion of the chassis between the substrate and the keyboard. In some examples, the portion of the chassis between the substrate and the keyboard that includes the transmission line is a support plate for the keyboard.