公开(公告)号：US10971440B2

公开(公告)日：2021-04-06

申请号：US16326688

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Khang Choong Yong ,  Po Yin Yaw ,  Kok Hou Teh

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/64 ,  H01L23/66

Abstract: Semiconductor package assemblies and semiconductor packages incorporating an impedance-boosting channel between a transmitter die and a receiver die are described. In an example, a semiconductor package includes a package substrate incorporating the impedance-boosting channel having a first arc segment connected to the transmitter die and a second arc segment connected to the receiver die. The arc segments extend around respective vertical axes passing through a transmitter die electrical bump and a receiver die electrical bump, respectively. Accordingly, the arc segments introduce an inductive circuitry to increase signal integrity of an electrical signal sent from the transmitter die to the receiver die.