公开(公告)号：US20230089096A1

公开(公告)日：2023-03-23

申请号：US17481234

申请日：2021-09-21

Applicant: Intel Corporation

Inventor： Andrew COLLINS ,  Srinivas V. PIETAMBARAM ,  Sanka GANESAN ,  Tarek A. IBRAHIM ,  Russell MORTENSEN

IPC: H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to packages that include one or more dies that are coupled with one or more glass layers. These glass layers may be within an interposer or a patch to which the one or more dies are attached. In addition, these glass layers may be used to facilitate pitch translation between the one or more dies proximate to a first side of the glass layer and a substrate proximate to a second side of the glass layer opposite the first side, to which the one or more dies are electrically coupled. Other embodiments may be described and/or claimed.