公开(公告)号：US20240332195A1

公开(公告)日：2024-10-03

申请号：US18129879

申请日：2023-04-02

申请人： Intel Corporation

发明人： Naiya SOETAN-DODD ,  Srinivas V. PIETAMBARAM ,  Suddhasattwa NAD ,  Brandon C. MARIN ,  Sheng C. LI ,  Liwei CHENG

IPC分类号： H01L23/538

CPC分类号： H01L23/5384 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/16 ,  H01L2224/16235

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a core, where the core comprises glass. In an embodiment, a cavity is in the core, and a bridge is in the cavity. In an embodiment, the bridge comprises through substrate vias (TSVs). In an embodiment, pads are at a bottom of the cavity, where the TSVs are electrically coupled to the pads.

公开(公告)号：US20240213328A1

公开(公告)日：2024-06-27

申请号：US18089494

申请日：2022-12-27

申请人： INTEL CORPORATION

发明人： Vinith BEJUGAM ,  Yonggang LI ,  Srinivas V. PIETAMBARAM ,  Chandrasekharan NAIR ,  Whitney BRYKS ,  Gene CORYELL

IPC分类号： H01L29/16 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L29/1606 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/16 ,  H01L2924/15311

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a via opening through the core. In an embodiment, the via opening comprises sidewalls. In an embodiment, a composite layer is provided along the sidewalls, and the composite layer comprises carbon. In an embodiment, the package substrate further comprises a via within the via opening, where the via is electrically conductive.

公开(公告)号：US20240213164A1

公开(公告)日：2024-06-27

申请号：US18089483

申请日：2022-12-27

申请人： Intel Corporation

发明人： Minglu LIU ,  Gang DUAN ,  Liang HE ,  Ziyin LIN ,  Elizabeth NOFEN ,  Yiqun BAI ,  Jonathan ATKINS ,  Jesus S. NIETO PESCADOR ,  Srinivas V. PIETAMBARAM ,  Kristof DARMAWIKARTA

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/5381 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/14 ,  H01L2224/16104

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.

公开(公告)号：US20240071935A1

公开(公告)日：2024-02-29

申请号：US17895965

申请日：2022-08-25

申请人： Intel Corporation

发明人： Brandon C. MARIN ,  Ravindranath V. MAHAJAN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Suddhasattwa NAD ,  Jeremy D. ECTON

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L23/5381 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/5386 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/08225 ,  H01L2224/80894 ,  H01L2224/80895

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate, where the first substrate comprises glass, and a second substrate over the first substrate, where the second substrate comprises glass. In an embodiment, electrically conductive routing is provided in the second substrate. In an embodiment, a first die is over the second substrate, and a second die is over the second substrate. In an embodiment, the electrically conductive routing electrically couples the first die to the second die.

公开(公告)号：US20240071848A1

公开(公告)日：2024-02-29

申请号：US17895916

申请日：2022-08-25

申请人： Intel Corporation

发明人： Bohan SHAN ,  Haobo CHEN ,  Brandon C. MARIN ,  Srinivas V. PIETAMBARAM ,  Bai NIE ,  Gang DUAN ,  Kyle ARRINGTON ,  Ziyin LIN ,  Hongxia FENG ,  Yiqun BAI ,  Xiaoying GUO ,  Dingying David XU ,  Jeremy D. ECTON ,  Kristof DARMAWIKARTA ,  Suddhasattwa NAD

IPC分类号： H01L23/15 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827

摘要： Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

公开(公告)号：US20240063203A1

公开(公告)日：2024-02-22

申请号：US17889962

申请日：2022-08-17

申请人： Intel Corporation

发明人： Brandon C. MARIN ,  Ravindranath V. MAHAJAN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Suddhasattwa NAD ,  Jeremy D. ECTON ,  Navneet SINGH ,  Sushil PADMANABHAN ,  Samarth ALVA

IPC分类号： H01L25/18 ,  H01L23/15 ,  H01L23/538 ,  H01L23/48 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56

CPC分类号： H01L25/18 ,  H01L23/15 ,  H01L23/5383 ,  H01L23/481 ,  H01L23/5384 ,  H01L21/486 ,  H01L21/4857 ,  H01L25/50 ,  H01L21/56

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.

公开(公告)号：US20240063127A1

公开(公告)日：2024-02-22

申请号：US17889238

申请日：2022-08-16

申请人： Intel Corporation

发明人： Jeremy D. ECTON ,  Brandon C. MARIN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Suddhasattwa NAD

IPC分类号： H01L23/538 ,  H01L23/498 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/5381 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/13 ,  H01L23/15 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L2924/1511 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15788 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate with a cavity, where the first substrate comprises glass. In an embodiment, a second substrate is in the cavity. In an embodiment, a bond film covers a bottom of the second substrate and extends up sidewalls of the second substrate.

公开(公告)号：US20230090759A1

公开(公告)日：2023-03-23

申请号：US17482747

申请日：2021-09-23

申请人： Intel Corporation

发明人： Srinivas V. PIETAMBARAM ,  Tarek A. IBRAHIM ,  Andrew COLLINS

IPC分类号： H01L23/64 ,  H01L23/14 ,  H01L23/48 ,  H01L21/50 ,  H01F3/02 ,  H01F3/10

摘要： Embodiments disclosed herein include electronic packages and methods of assembling such packages. In an embodiment, an electronic package comprises a core. In an embodiment the core comprises glass. In an embodiment, buildup layers are over the core, and a plug is embedded in the buildup layers. In an embodiment, the plug comprises a magnetic material. In an embodiment, an inductor wraps around the plug.

公开(公告)号：US20230089096A1

公开(公告)日：2023-03-23

申请号：US17481234

申请日：2021-09-21

申请人： Intel Corporation

发明人： Andrew COLLINS ,  Srinivas V. PIETAMBARAM ,  Sanka GANESAN ,  Tarek A. IBRAHIM ,  Russell MORTENSEN

IPC分类号： H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques directed to packages that include one or more dies that are coupled with one or more glass layers. These glass layers may be within an interposer or a patch to which the one or more dies are attached. In addition, these glass layers may be used to facilitate pitch translation between the one or more dies proximate to a first side of the glass layer and a substrate proximate to a second side of the glass layer opposite the first side, to which the one or more dies are electrically coupled. Other embodiments may be described and/or claimed.

公开(公告)号：US20230086356A1

公开(公告)日：2023-03-23

申请号：US17481237

申请日：2021-09-21

申请人： Intel Corporation

发明人： Andrew COLLINS ,  Srinivas V. PIETAMBARAM ,  Tarek A. IBRAHIM ,  Sanka GANESAN ,  Ram S. VISWANATH

IPC分类号： H01L23/498 ,  H01L21/48

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques directed to glass core-based substrates with an asymmetric number of front and back-side copper layers. In embodiments, the front and/or backside copper layers may be referred to as stack ups or as buildup layers on the glass core substrate. Embodiments may allow lower overall substrate layer counts by allowing for more front side layers where the signal routing may typically be highest, without requiring a matching, or symmetric, number of backside copper layers. Other embodiments may be described and/or claimed.