公开(公告)号：US20250105207A1

公开(公告)日：2025-03-27

申请号：US18473046

申请日：2023-09-22

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Nitin Ashok Deshpande ,  Dimitrios Antartis ,  Gwang-Soo Kim ,  Shawna Marie Liff

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48

Abstract: Systems, apparatus, and articles of manufacture are disclosed to enable integrated circuit packages with double hybrid bonded dies and methods of manufacturing the same include an integrated circuit (IC) package including a first semiconductor die including first metal vias spaced apart along a first layer of a first dielectric material, the first metal vias connected to respective first metal pads of the first semiconductor die, a second semiconductor die including second metal pads of the second semiconductor die, and a hybrid bond layer including a third dielectric material and third metal vias spaced apart along the third dielectric material, a subset of the third metal vias electrically coupling ones of the first metal pads to respective ones of the second metal pads, a first one of the third metal vias positioned beyond a lateral side of the first semiconductor die.