公开(公告)号：US20200381388A1

公开(公告)日：2020-12-03

申请号：US16424227

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Feroz MOHAMMAD ,  Srinivasa R. ARAVAMUDHAN

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/34

Abstract: Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.