公开(公告)号：US20220391007A1

公开(公告)日：2022-12-08

申请号：US17886366

申请日：2022-08-11

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  George VERGIS ,  Stephen P. CHRISTIANSON ,  Ankita TIWARI ,  Virendra Vikramsinh ADSURE

IPC: G06F1/3234 ,  H01L23/14

Abstract: Apparatus, assemblies, and platforms employing modular power voltage regulator (VR) modules to provide power to memory modules. A power VR module includes VR circuitry integrated on or coupled to a substrate with wiring coupling the VR circuitry to connector elements in first and second connector means. An assembly further includes a pair of memory modules (e.g., DDR) that are coupled to a power VR module via mating connector means. The connector means may be coupled using a Compression Mount Technology (CMT) connector disposed between arrays of CMT contact pads on the power VR module and the memory modules, or may comprise BGAs, PGAs, and LGAs. The power VR module receives one or more input voltages via one or both memory module and provide various output voltages to each of the memory modules to power memory devices and other circuitry on those modules.