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公开(公告)号：US20250007279A1
公开(公告)日：2025-01-02
申请号：US18215033
申请日：2023-06-27
Applicant: Intel Corporation
Inventor： Susanne Heber , Daniel Gruber , Krzysztof Domanski , Martin Clara
IPC: H02H9/04
Abstract: An integrated circuit device includes a signal pad, an inductor coupled in series with the signal pad, and an electrostatic discharge (ESD) protection circuit distributed before and after the inductor to provide ESD protection for an ESD event on the signal pad. Other examples are disclosed and claimed.
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