公开(公告)号：US11205616B2

公开(公告)日：2021-12-21

申请号：US16604807

申请日：2017-06-20

Applicant: Intel Corporation

Inventor： Smita Shridharan ,  Zheng Guo ,  Eric A. Karl ,  George Shchupak ,  Tali Kosinovsky

IPC: H01L23/528 ,  H01L23/535 ,  H01L27/092 ,  H01L27/11

Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.

公开(公告)号：US12224239B2

公开(公告)日：2025-02-11

申请号：US18599049

申请日：2024-03-07

Applicant: Intel Corporation

Inventor： Smita Shridharan ,  Zheng Guo ,  Eric A. Karl ,  George Shchupak ,  Tali Kosinovsky

IPC: H01L23/528 ,  H01L23/535 ,  H01L27/092 ,  H10B10/00

Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.

公开(公告)号：US11640939B2

公开(公告)日：2023-05-02

申请号：US17524665

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Smita Shridharan ,  Zheng Guo ,  Eric A. Karl ,  George Shchupak ,  Tali Kosinovsky

IPC: H01L23/528 ,  H01L23/535 ,  H01L27/092 ,  H01L27/11

Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.

公开(公告)号：US11973032B2

公开(公告)日：2024-04-30

申请号：US18119225

申请日：2023-03-08

Applicant: Intel Corporation

Inventor： Smita Shridharan ,  Zheng Guo ,  Eric A. Karl ,  George Shchupak ,  Tali Kosinovsky

IPC: H01L23/528 ,  H01L23/535 ,  H01L27/092 ,  H10B10/00

CPC classification number: H01L23/528 ,  H01L23/535 ,  H01L27/0924 ,  H10B10/12

Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.